P

Inventor

CHEN CHUN-JEN

TW109 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHUN-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

16 patents
US10573573B2Feb 25, 2020

Package and package-on-package structure having elliptical conductive columns

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10163843B2Dec 25, 2018

Semiconductor device structure and manufacturing method

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10090267B2Oct 2, 2018

Bump structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations72
US9997482B2Jun 12, 2018

Solder stud structure

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US9806046B2Oct 31, 2017

Semiconductor device structure and manufacturing method

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US9735123B2Aug 15, 2017

Semiconductor device structure and manufacturing method

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations72
US12444647B2Oct 14, 2025

Electron migration control in interconnect structures

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12354907B2Jul 8, 2025

Electron migration control in interconnect structures

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051634B2Jul 30, 2024

Package and package-on-package structure having elliptical columns and ellipsoid joint terminals

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11756849B2Sep 12, 2023

Package and package-on-package structure having elliptical columns and ellipsoid joint terminals

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11404341B2Aug 2, 2022

Package and package-on-package structure having elliptical columns and ellipsoid joint terminals

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11264273B2Mar 1, 2022

Electron migration control in interconnect structures

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11217548B2Jan 4, 2022

Semiconductor device structure and manufacturing method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11145613B2Oct 12, 2021

Method for forming bump structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11488891B2Nov 1, 2022

Method of forming conductive bumps for cooling device connection and semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US9899296B2Feb 20, 2018

Method of forming conductive bumps for cooling device connection

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61

UNITED MICROELECTRONICS CORP

11 patents

HON HAI PREC IND CO LTD

6 patents

LIN CHIN-HSIANG

2 patents

CHEN CHUN-JEN

2 patents

ADVANCED SEMICONDUCTOR ENG

2 patents

CHANG HONG-YEH

2 patents

ROCK KENNETH L

1 patent

WANG KUO-JENG

1 patent

WU DAN-CHEN

1 patent

LITE ON ELECTRONICS INC

1 patent

HUANG TSUNG-SHENG

1 patent

UNIV CHINA MEDICAL

1 patent

TRANSPACIFIC IP LTD

1 patent

HSU SHOU-KUO

1 patent

POLAROID IP B V

1 patent

Showing the top 50 of 109 patents by PatentIndex Score.