Inventor
SETAKA RYOJI
JP5 patents
Patents
5 patentsUS6517744B1Feb 11, 2003
Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure
JSR CORP81 citations96
US6849335B2Feb 1, 2005
Anisotropic conductive sheet
JSR CORP12 citations83
US7095241B2Aug 22, 2006
Anisotropic conductive connector, probe member, wafer inspecting device, and wafer inspecting method
JSR CORP19 citations82
US7131851B2Nov 7, 2006
Anisotropic conductivity connector, conductive paste composition, probe member, and wafer inspection device, and wafer inspecting method
JSR CORP12 citations81
US7049836B2May 23, 2006
Anisotropic conductivity connector, conductive paste composition, probe member, and wafer inspection device, and wafer inspecting method
JSR CORP20 citations81