Inventor · disambiguated record
Vincent Hool
Also filed as: HOOL VINCENT
10 granted patents·1 pending application·191 citations·filing 2002–2016
90Inventor score
Top patents by PatentIndex Score
11 records- 0191US9368440B1Embedded coaxial wire and method of manufactureALTERA CORP·Filed 2013·Granted Jun 14, 2016·14 cites·19 claims
- 0290US9385060B1Integrated circuit package with enhanced thermal conductionALTERA CORP·Filed 2014·Granted Jul 5, 2016·12 cites·11 claims
- 0390US6864565B1Post-passivation thick metal pre-routing for flip chip packagingALTERA CORP·Filed 2002·Granted Mar 8, 2005·65 cites·23 claims
- 0488US7501709B1BGA package with wiring schemes having reduced current loop paths to improve cross talk control and characteristic impedanceALTERA CORP·Filed 2006·Granted Mar 10, 2009·19 cites·21 claims
- 0588US7115988B1Bypass capacitor embedded flip chip package lid and stiffenerALTERA CORP·Filed 2004·Granted Oct 3, 2006·59 cites·16 claims
- 0685US9679861B1Integrated circuit package with active warpage control printed circuit board mountALTERA CORP·Filed 2016·Granted Jun 13, 2017·5 cites·20 claims
- 0775US7391122B1Techniques for flip chip package migrationALTERA CORP·Filed 2005·Granted Jun 24, 2008·6 cites·25 claims
- 0873US8217500B1Semiconductor device packageHOOL VINCENT·Filed 2010·Granted Jul 10, 2012·5 cites·22 claims
- 0953US7276399B1Method of designing a module-based flip chip substrate designALTERA CORP·Filed 2004·Granted Oct 2, 2007·6 cites·28 claims
- 1038US9648728B1Coreless organic substrateALTERA CORP·Filed 2015·Granted May 9, 2017·0 cites·27 claims
- 1138US2009057867A1Integrated Circuit Package with Passive ComponentHOOL VINCENT·Filed 2007·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →