Inventor

YUN JAEUN

KR7 patents

⚠️ This page may combine multiple inventors who share the name “YUN JAEUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHOI DAESIK

2 patents

US8263435B2Sep 11, 2012

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

CHOI DAESIK47 citations96

US9252032B2Feb 2, 2016

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

CHOI DAESIK6 citations83

YUN JAEUN

2 patents

US8524537B2Sep 3, 2013

Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue

YUN JAEUN4 citations57

US8415204B2Apr 9, 2013

Integrated circuit packaging system with heat spreader and method of manufacture thereof

YUN JAEUN0 citations47

LIM TAEGKI

1 patent

US9136144B2Sep 15, 2015

Method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulation

LIM TAEGKI10 citations73

KO WONJUN

1 patent

US8569882B2Oct 29, 2013

Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof

KO WONJUN5 citations71

STATS CHIPPAC LTD

1 patent

US7969023B2Jun 28, 2011

Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof

STATS CHIPPAC LTD0 citations50