Inventor
LEE KWANJAI
KR8 patents
⚠️ This page may combine multiple inventors who share the name “LEE KWANJAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
6 patentsUS9177904B2Nov 3, 2015
Chip-on-film package and device assembly including the same
SAMSUNG ELECTRONICS CO LTD16 citations91
US9241407B2Jan 19, 2016
Tape film packages and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations71
US12191246B2Jan 7, 2025
Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal
SAMSUNG ELECTRONICS CO LTD0 citations61
US11830803B2Nov 28, 2023
Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal
SAMSUNG ELECTRONICS CO LTD0 citations61
US12148337B2Nov 19, 2024
Chip on film package with trench to reduce slippage and display device including the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US9620389B2Apr 11, 2017
Methods of fabricating tape film packages
SAMSUNG ELECTRONICS CO LTD1 citations50