Inventor
KANG JUNGHOON
KR11 patents
⚠️ This page may combine multiple inventors who share the name “KANG JUNGHOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
10 patentsUS11348807B2May 31, 2022
Semiconductor package, electronic apparatus and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations80
US12488996B2Dec 2, 2025
Semiconductor package having pad pattern including plastically deformed metal film
SAMSUNG ELECTRONICS CO LTD0 citations61
US12100668B2Sep 24, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11837553B2Dec 5, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11798814B2Oct 24, 2023
Semiconductor package, electronic apparatus and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US12550747B2Feb 10, 2026
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12230580B2Feb 18, 2025
Method of manufacturing semiconductor package, and semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations48
US11929315B2Mar 12, 2024
Semiconductor package having pad with regular and irregular depressions and protrusions and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations48
US12341118B2Jun 24, 2025
Semiconductor package including an encapsulant
SAMSUNG ELECTRONICS CO LTD0 citations45
US12374667B2Jul 29, 2025
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations44