Inventor

JUNG BOO YANG

SG11 patents

⚠️ This page may combine multiple inventors who share the name “JUNG BOO YANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GLOBALFOUNDRIES SG PTE LTD

4 patents

US10361162B1Jul 23, 2019

Magnetic shielding of STT-MRAM in multichip packaging and method of manufacturing the same

GLOBALFOUNDRIES SG PTE LTD4 citations73

US10290678B2May 14, 2019

Magnetic shielding package structure for MRAM device and method for producing the same

GLOBALFOUNDRIES SG PTE LTD2 citations72

US11018093B2May 25, 2021

Magnetic shielding of STT-MRAM in multichip packaging and method of manufacturing the same

GLOBALFOUNDRIES SG PTE LTD0 citations62

US10686008B2Jun 16, 2020

Magnetic shielding package structure for MRAM device and method for producing the same

GLOBALFOUNDRIES SG PTE LTD1 citations62

KIM SANG WON

1 patent

US8294276B1Oct 23, 2012

Semiconductor device and fabricating method thereof

KIM SANG WON27 citations91

AMKOR TECH SINGAPORE HOLDING PTE LTD

1 patent

US11855023B2Dec 26, 2023

Wafer level fan out semiconductor device and manufacturing method thereof

AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62

AMKOR TECHNOLOGY INC

1 patent

US10903181B2Jan 26, 2021

Wafer level fan out semiconductor device and manufacturing method thereof

AMKOR TECHNOLOGY INC0 citations62

SAMSUNG TECHWIN CO LTD

1 patent

US7129719B2Oct 31, 2006

Apparatus for detecting defect in circuit pattern and defect detecting system having the same

SAMSUNG TECHWIN CO LTD5 citations59

JUNG BOO YANG

1 patent

US9748154B1Aug 29, 2017

Wafer level fan out semiconductor device and manufacturing method thereof

JUNG BOO YANG1 citations45

OH HUENG JAE

1 patent

US8785789B2Jul 22, 2014

Printed circuit board and method for manufacturing the same

OH HUENG JAE0 citations36

AGENCY SCIENCE TECH & RES

1 patent

US10727207B2Jul 28, 2020

Semiconductor packaging structure and method of forming the same

AGENCY SCIENCE TECH & RES0 citations30