Inventor

CHUN KUKJIN

KR3 patents

⚠️ This page may combine multiple inventors who share the name “CHUN KUKJIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

1 patent

US6884650B2Apr 26, 2005

Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same

SAMSUNG ELECTRONICS CO LTD31 citations91

HYUNDAI MOTOR CO LTD

1 patent

US9759675B2Sep 12, 2017

Particulate matter sensor unit

HYUNDAI MOTOR CO LTD3 citations70

UNITEST INC

1 patent

US7285967B2Oct 23, 2007

Probe card having deeply recessed trench and method for manufacturing the same

UNITEST INC7 citations68