Inventor
TAN CHER KHNG VICTOR
SG11 patents
Patents
11 patentsUS7754531B2Jul 13, 2010
Method for packaging microelectronic devices
MICRON TECHNOLOGY INC49 citations97
US7112520B2Sep 26, 2006
Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
MICRON TECHNOLOGY INC60 citations96
US7230330B2Jun 12, 2007
Semiconductor die packages with recessed interconnecting structures
MICRON TECHNOLOGY INC20 citations92
US6779386B2Aug 24, 2004
Method and apparatus for detecting topographical features of microelectronic substrates
MICRON TECHNOLOGY INC14 citations90
US6787923B2Sep 7, 2004
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks
MICRON TECHNOLOGY INC32 citations89
US7061124B2Jun 13, 2006
Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks
MICRON TECHNOLOGY INC10 citations72
US7018871B2Mar 28, 2006
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods
MICRON TECHNOLOGY INC10 citations72
US6923045B2Aug 2, 2005
Method and apparatus for detecting topographical features of microelectronic substrates
MICRON TECHNOLOGY INC11 citations71
US7368391B2May 6, 2008
Methods for designing carrier substrates with raised terminals
MICRON TECHNOLOGY INC8 citations70
US7569473B2Aug 4, 2009
Methods of forming semiconductor assemblies
MICRON TECHNOLOGY INC2 citations62
US7213447B2May 8, 2007
Method and apparatus for detecting topographical features of microelectronic substrates
MICRON TECHNOLOGY INC1 citations50