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Inventor
WANG FU-HSIEN
TW
5 patents
⚠️ This page may combine multiple inventors who share the name “WANG FU-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMILEDS OPTOELECTRONICS CO
2 patents
US7968379B2
Jun 28, 2011
Method of separating semiconductor dies
SEMILEDS OPTOELECTRONICS CO
5 citations
73
US8716041B2
May 6, 2014
Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer paths
SEMILEDS OPTOELECTRONICS CO
2 citations
62
SEMI PHOTONICS CO LTD
1 patent
US7452739B2
Nov 18, 2008
Method of separating semiconductor dies
SEMI PHOTONICS CO LTD
23 citations
92
CHU CHEN-FU
1 patent
US8802469B2
Aug 12, 2014
Method of fabricating semiconductor die using handling layer
CHU CHEN-FU
1 citations
51
DOAN TRUNG TRI
1 patent
US8552458B2
Oct 8, 2013
Side by side light emitting diode (LED) having separate electrical and heat transfer paths
DOAN TRUNG TRI
1 citations
51