Inventor
GONDCHARTON PAUL
FR9 patents
Patents
9 patentsUS10115698B2Oct 30, 2018
Method for direct adhesion via low-roughness metal layers
COMMISSARIAT ENERGIE ATOMIQUE1 citations49
US10032742B2Jul 24, 2018
Method for obtaining a bonding surface for direct bonding
COMMISSARIAT ENERGIE ATOMIQUE0 citations49
US10403597B2Sep 3, 2019
Direct bonding method
COMMISSARIAT ENERGIE ATOMIQUE0 citations48
US10710192B2Jul 14, 2020
Method for adhering a first structure and a second structure
COMMISSARIAT ENERGIE ATOMIQUE0 citations39
US10679963B2Jun 9, 2020
Method for assembling two substrates of different natures via a ductile intermediate layer
COMMISSARIAT ENERGIE ATOMIQUE0 citations39
US10483111B2Nov 19, 2019
Metal-metal direct bonding method
COMMISSARIAT ENERGIE ATOMIQUE0 citations39
US9922953B2Mar 20, 2018
Process for producing a structure by assembling at least two elements by direct adhesive bonding
COMMISSARIAT ENERGIE ATOMIQUE0 citations39
US9472530B2Oct 18, 2016
Method for carrying out a conductive direct metal bonding
COMMISSARIAT ENERGIE ATOMIQUE0 citations39
US9735038B2Aug 15, 2017
Process for manufacturing a semiconductor structure with temporary bonding via metal layers
COMMISSARIAT ENERGIE ATOMIQUE0 citations34