Inventor
ICHIYAMA HIDEYUKI
JP10 patents
⚠️ This page may combine multiple inventors who share the name “ICHIYAMA HIDEYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
9 patentsUS5900582AMay 4, 1999
Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame
MITSUBISHI ELECTRIC CORP106 citations98
US5207102AMay 4, 1993
Semiconductor pressure sensor
MITSUBISHI ELECTRIC CORP127 citations97
US5814883ASep 29, 1998
Packaged semiconductor chip
MITSUBISHI ELECTRIC CORP313 citations96
US5763829AJun 9, 1998
Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe
MITSUBISHI ELECTRIC CORP38 citations96
US5592019AJan 7, 1997
Semiconductor device and module
MITSUBISHI ELECTRIC CORP341 citations96
US5535509AJul 16, 1996
Method of making a lead on chip (LOC) semiconductor device
MITSUBISHI ELECTRIC CORP68 citations96
US5373190ADec 13, 1994
Resin-sealed semiconductor device
MITSUBISHI ELECTRIC CORP19 citations81
US5724726AMar 10, 1998
Method of making leadframe for lead-on-chip (LOC) semiconductor device
MITSUBISHI ELECTRIC CORP11 citations73
US4974052ANov 27, 1990
Plastic packaged semiconductor device
MITSUBISHI ELECTRIC CORP5 citations62