Inventor
KOHIKI MICHIYA
JP11 patents
⚠️ This page may combine multiple inventors who share the name “KOHIKI MICHIYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
JX NIPPON MINING & METALS CORP
8 patentsUS10349531B2Jul 9, 2019
Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method
JX NIPPON MINING & METALS CORP3 citations71
US9930776B2Mar 27, 2018
Ultrathin copper foil and method of manufacturing the same, and ultrathin copper layer
JX NIPPON MINING & METALS CORP2 citations71
US10187983B2Jan 22, 2019
Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
JX NIPPON MINING & METALS CORP2 citations70
US9578741B2Feb 21, 2017
Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring board
JX NIPPON MINING & METALS CORP4 citations70
US10257938B2Apr 9, 2019
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
JX NIPPON MINING & METALS CORP1 citations60
US10178775B2Jan 8, 2019
Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
JX NIPPON MINING & METALS CORP1 citations58
US9839124B2Dec 5, 2017
Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
JX NIPPON MINING & METALS CORP1 citations50
US9788423B2Oct 10, 2017
Copper foil with carrier
JX NIPPON MINING & METALS CORP1 citations49
KOHIKI MICHIYA
3 patentsUS9028972B2May 12, 2015
Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring board
KOHIKI MICHIYA4 citations68
US8568899B2Oct 29, 2013
Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit board
KOHIKI MICHIYA1 citations43
US8721864B2May 13, 2014
Process and apparatus for producing a metal covered polyimide composite
KOHIKI MICHIYA0 citations33