Inventor

SAWADA SUSUMU

31 patents

⚠️ This page may combine multiple inventors who share the name “SAWADA SUSUMU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAWADA SUSUMU

PANASONIC IP MAN CO LTD

Flexible substrate including stretchable sheet

Tactile sensor that includes two sheets each having at least either flexibility or elasticity

Flexible touch sensor and method of manufacturing the same

Electronic component package and method for manufacturing same

Electronic component package and method for manufacturing the same

Electronic component package and method for manufacturing same

Flexible optical substrate

Semiconductor device and method for manufacturing the same

Electronic part package

Electronic component package and method of manufacturing same

Ceramic substrate composite and method for manufacturing ceramic substrate composite

Electronic component package and method for manufacturing the same

PANASONIC CORP

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

Parallel differential transmission lines having an opposing grounding conductor separated into two parts by a slot therein

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package

Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates

Light-emitting device and method for manufacturing the same

JAPAN ENERGY CORP

Sputtering targets of high-purity aluminum or alloy thereof

High purity titanium sputtering targets

Sputtering targets having life alarm function

Thin-film forming apparatus

Titanium implantation materials for the living body

MITSUBISHI CHEM IND

Method and apparatus for fusing together thermoplastic synthetic resin molded articles

Welding apparatus

NAKATANI SEIICHI

Semiconductor device having semiconductor elements formed inside a resin film substrate

Transistor having an organic semiconductor with a hollow space

JAPAN STEEL WORKS LTD

Method for providing single piece with plural different mechanical characteristics

KITAE TAKASHI

Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates

SAWADA SUSUMU

Flip chip connection structure having powder-like conductive substance and method of producing the same

KARASHIMA SEIJI

Bump forming method using self-assembling resin and a wall surface