Inventor · disambiguated record
Bongjin Son
Also filed as: SON BONGJIN
6 granted patents·1 pending application·4 citations·filing 2013–2023
71Inventor score
Top patents by PatentIndex Score
7 records- 0165US9899294B2Thermal interface material layer and package-on-package device including the sameNA MIN OK·Filed 2013·Granted Feb 20, 2018·2 cites·18 claims
- 0264US10319619B2Equipment for manufacturing semiconductor devices and method for use of same for manufacturing semiconductor package componentsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 11, 2019·2 cites·12 claims
- 0359US10950521B2Thermal interface material layer and package-on-package device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 0455US10431522B2Thermal interface material layer and package-on-package device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 1, 2019·0 cites·20 claims
- 0554US2024222409A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0649US12278248B2Image sensor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 15, 2025·0 cites·15 claims
- 0748US12062594B2Integrated circuit device including a through-via structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →