Inventor
ZHOU YUNPENG
CN2 patents
Patents
2 patentsUS11069647B2Jul 20, 2021
Semiconductor wafer, bonding structure and wafer bonding method
WUHAN XINXIN SEMICONDUCTOR MFG2 citations65
US11264242B2Mar 1, 2022
Method and apparatus for determining expansion compensation in photoetching process, and method for manufacturing device
WUHAN XINXIN SEMICONDUCTOR MFG0 citations46