Inventor
HAEHN NICHOLAS S
US16 patents
Patents
16 patentsUS12261150B2Mar 25, 2025
Mold shelf package design and process flow for advanced package architectures
INTEL CORP1 citations74
US12087731B2Sep 10, 2024
No mold shelf package design and process flow for advanced package architectures
INTEL CORP1 citations72
US11901333B2Feb 13, 2024
No mold shelf package design and process flow for advanced package architectures
INTEL CORP1 citations72
US10553548B2Feb 4, 2020
Methods of forming multi-chip package structures
INTEL CORP6 citations71
US12009271B2Jun 11, 2024
Protruding SN substrate features for epoxy flow control
INTEL CORP2 citations70
US10576590B2Mar 3, 2020
Torque controlled driver apparatus and method
INTEL CORP2 citations65
US11942393B2Mar 26, 2024
Substrate with thermal insulation
INTEL CORP0 citations62
US11502008B2Nov 15, 2022
Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage control
INTEL CORP0 citations61
US12543578B2Feb 3, 2026
Electronic packaging architecture with customized variable metal thickness on same buildup layer
INTEL CORP0 citations59
US12362250B2Jul 15, 2025
Protruding SN substrate features for epoxy flow control
INTEL CORP0 citations59
US11832419B2Nov 28, 2023
Full package vapor chamber with IHS
INTEL CORP0 citations59
US11776864B2Oct 3, 2023
Corner guard for improved electroplated first level interconnect bump height range
INTEL CORP0 citations59
US10515824B2Dec 24, 2019
Enhanced etch anisotropy using nanoparticles as banking agents in the presence or absence of a magnetic or electrical field
INTEL CORP0 citations50
US12334453B2Jun 17, 2025
Soldered metallic reservoirs for enhanced transient and steady-state thermal performance
INTEL CORP0 citations49
US10438812B2Oct 8, 2019
Anisotropic etching systems and methods using a photochemically enhanced etchant
INTEL CORP0 citations48
US10428439B2Oct 1, 2019
Predictive capability for electroplating shield design
INTEL CORP0 citations38