Inventor
LIM THIAM B
SG10 patents
⚠️ This page may combine multiple inventors who share the name “LIM THIAM B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
7 patentsUS5319241AJun 7, 1994
Lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution
TEXAS INSTRUMENTS INC60 citations95
US5434106AJul 18, 1995
Integrated circuit device and method to prevent cracking during surface mount
TEXAS INSTRUMENTS INC55 citations94
US5313102AMay 17, 1994
Integrated circuit device having a polyimide moisture barrier coating
TEXAS INSTRUMENTS INC43 citations94
US5206536AApr 27, 1993
Comb insert for semiconductor packaged devices
TEXAS INSTRUMENTS INC24 citations92
US5164815ANov 17, 1992
Integrated circuit device and method to prevent cracking during surface mount
TEXAS INSTRUMENTS INC38 citations92
US5229329AJul 20, 1993
Method of manufacturing insulated lead frame for integrated circuits
TEXAS INSTRUMENTS INC30 citations87
US5155578AOct 13, 1992
Bond wire configuration and injection mold for minimum wire sweep in plastic IC packages
TEXAS INSTRUMENTS INC36 citations86
LIM THIAM B
2 patentsUS5227232AJul 13, 1993
Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution
LIM THIAM B80 citations94
US5146312ASep 8, 1992
Insulated lead frame for semiconductor packaged devices
LIM THIAM B9 citations71