Inventor
GWIASDA JOERG
DE3 patents
Patents
3 patentsUS5928458AJul 27, 1999
Flip chip bonding with non conductive adhesive
FRAUNHOFER GES FORSCHUNG21 citations90
US5956232ASep 21, 1999
Chip support arrangement and chip support for the manufacture of a chip casing
FRAUNHOFER GES FORSCHUNG6 citations61
US5845838ADec 8, 1998
Process for remelting a contact surface metallization
FRAUNHOFER GES FORSCHUNG2 citations59