Inventor
CHAPMAN GREGORY M
US28 patents
Patents
28 patentsUS7677429B2Mar 16, 2010
Concave face wire bond capillary and method
MICRON TECHNOLOGY INC103 citations98
US7416107B2Aug 26, 2008
Concave face wire bond capillary and method
MICRON TECHNOLOGY INC102 citations98
US6439450B1Aug 27, 2002
Concave face wire bond capillary
MICRON TECHNOLOGY INC119 citations98
US6158647ADec 12, 2000
Concave face wire bond capillary
MICRON TECHNOLOGY INC162 citations98
US5375320ADec 27, 1994
Method of forming "J" leads on a semiconductor device
MICRON TECHNOLOGY INC61 citations94
US6966480B2Nov 22, 2005
Concave face wire bond capillary and method
MICRON TECHNOLOGY INC13 citations92
US6311890B1Nov 6, 2001
Concave face wire bond capillary
MICRON TECHNOLOGY INC17 citations92
US6013535AJan 11, 2000
Method for applying adhesives to a lead frame
MICRON TECHNOLOGY INC30 citations92
US6638831B1Oct 28, 2003
Use of a reference fiducial on a semiconductor package to monitor and control a singulation method
MICRON TECHNOLOGY INC15 citations91
US6683378B2Jan 27, 2004
System for singulating semiconductor components utilizing alignment pins
MICRON TECHNOLOGY INC20 citations89
US6595406B2Jul 22, 2003
Concave face wire bond capillary and method
MICRON TECHNOLOGY INC12 citations81
US7087133B2Aug 8, 2006
Methods for application of adhesive tape to semiconductor devices
MICRON TECHNOLOGY INC4 citations74
US6956272B2Oct 18, 2005
Support frame for semiconductor packages
MICRON TECHNOLOGY INC6 citations74
US6883574B2Apr 26, 2005
Apparatus for application of adhesive tape to semiconductor devices
MICRON TECHNOLOGY INC4 citations74
US6623592B1Sep 23, 2003
Methods for application of adhesive tape to semiconductor devices
MICRON TECHNOLOGY INC6 citations74
US6607019B2Aug 19, 2003
Method and apparatus for application of adhesive tape to semiconductor devices
MICRON TECHNOLOGY INC7 citations74
US6346152B1Feb 12, 2002
Method and apparatus for applying adhesives to a lead frame
MICRON TECHNOLOGY INC10 citations74
US6267167B1Jul 31, 2001
Method and apparatus for application of adhesive tape to semiconductor devices
MICRON TECHNOLOGY INC9 citations74
US6096165AAug 1, 2000
Method and apparatus for application of adhesive tape to semiconductor devices
MICRON TECHNOLOGY INC9 citations74
US6744134B2Jun 1, 2004
Use of a reference fiducial on a semiconductor package to monitor and control a singulation method
MICRON TECHNOLOGY INC5 citations72
US6787382B1Sep 7, 2004
Method and system for singulating semiconductor components
MICRON TECHNOLOGY INC6 citations70
US6890384B2May 10, 2005
Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid
MICRON TECHNOLOGY INC2 citations63
US6818460B2Nov 16, 2004
Method for applying adhesives to a lead frame
MICRON TECHNOLOGY INC3 citations63
US6485778B1Nov 26, 2002
Method of applying an adhesive material to lead fingers of a lead frame
MICRON TECHNOLOGY INC2 citations63
US6336973B1Jan 8, 2002
Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid
MICRON TECHNOLOGY INC3 citations63
US4977993ADec 18, 1990
Out-of-tube inspection part holder
MICRON TECHNOLOGY INC5 citations63
US7271018B2Sep 18, 2007
Method of forming a support frame for semiconductor packages
MICRON TECHNOLOGY INC0 citations52
US7087116B2Aug 8, 2006
Apparatus for modifying the configuration of an exposed surface of a viscous fluid
MICRON TECHNOLOGY INC0 citations52