Inventor
SAHARA KUNIZO
JP6 patents
Patents
6 patentsUS5067007ANov 19, 1991
Semiconductor device having leads for mounting to a surface of a printed circuit board
HITACHI LTD360 citations98
US4764804AAug 16, 1988
Semiconductor device and process for producing the same
HITACHI LTD236 citations98
US5188280AFeb 23, 1993
Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
HITACHI LTD114 citations96
US5090609AFeb 25, 1992
Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
HITACHI LTD98 citations95
US5309011AMay 3, 1994
Wafer scale or full wafer memory system, packaging method thereof, and wafer processing method employed therein
HITACHI LTD24 citations91
US5191224AMar 2, 1993
Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein
HITACHI LTD17 citations81