Inventor

JEONG JEONG HWAN

KR3 patents

⚠️ This page may combine multiple inventors who share the name “JEONG JEONG HWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG SDI CO LTD

2 patents

US10607853B2Mar 31, 2020

CMP slurry composition for polishing copper line and polishing method using same

SAMSUNG SDI CO LTD1 citations57

US10150890B2Dec 11, 2018

CMP slurry composition for polishing copper and polishing method using the same

SAMSUNG SDI CO LTD0 citations48

CHEIL IND INC

1 patent

US9593260B2Mar 14, 2017

CMP slurry composition for polishing copper, and polishing method using same

CHEIL IND INC0 citations48