Inventor
LEE WAI M
US10 patents
⚠️ This page may combine multiple inventors who share the name “LEE WAI M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EKC TECHNOLOGY INC
9 patentsUS5334332AAug 2, 1994
Cleaning compositions for removing etching residue and method of using
EKC TECHNOLOGY INC247 citations98
US5279771AJan 18, 1994
Stripping compositions comprising hydroxylamine and alkanolamine
EKC TECHNOLOGY INC126 citations98
US6566276B2May 20, 2003
Method of making electronic materials
EKC TECHNOLOGY INC85 citations97
US5482566AJan 9, 1996
Method for removing etching residue using a hydroxylamine-containing composition
EKC TECHNOLOGY INC85 citations96
US5381807AJan 17, 1995
Method of stripping resists from substrates using hydroxylamine and alkanolamine
EKC TECHNOLOGY INC72 citations96
US5399464AMar 21, 1995
Triamine positive photoresist stripping composition and post-ion implantation baking
EKC TECHNOLOGY INC69 citations95
US4824763AApr 25, 1989
Triamine positive photoresist stripping composition and prebaking process
EKC TECHNOLOGY INC110 citations95
US4395348AJul 26, 1983
Photoresist stripping composition and method
EKC TECHNOLOGY INC93 citations95
US6696363B2Feb 24, 2004
Method of and apparatus for substrate pre-treatment
EKC TECHNOLOGY INC30 citations90