P

Inventor

KANG MINSEOK

KR16 patents
⚠️ This page may combine multiple inventors who share the name “KANG MINSEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

12 patents
US11537042B2Dec 27, 2022

Overlay correcting method, and photolithography method, semiconductor device manufacturing method and scanner system based on the overlay correcting method

SAMSUNG ELECTRONICS CO LTD3 citations72
US11849201B2Dec 19, 2023

Foldable electronic device and method for displaying images based on folding state of foldable electronic device

SAMSUNG ELECTRONICS CO LTD3 citations70
US10317764B2Jun 11, 2019

Method and electronic device for executing screen security function

SAMSUNG ELECTRONICS CO LTD2 citations67
US11921421B2Mar 5, 2024

Overlay correcting method, and photolithography method, semiconductor device manufacturing method and scanner system based on the overlay correcting method

SAMSUNG ELECTRONICS CO LTD0 citations61
US12130728B2Oct 29, 2024

Electronic device and method controlling the same

SAMSUNG ELECTRONICS CO LTD0 citations55
US11157140B2Oct 26, 2021

Interface providing method for multitasking and electronic device implementing the same

SAMSUNG ELECTRONICS CO LTD0 citations51
US11914916B2Feb 27, 2024

Method for controlling display and electronic device therefor

SAMSUNG ELECTRONICS CO LTD0 citations50
US12153849B2Nov 26, 2024

Foldable electronic device and method for displaying information in foldable electronic device

SAMSUNG ELECTRONICS CO LTD0 citations48
US12406613B2Sep 2, 2025

Electronic device including display and camera and method controlling thereof

SAMSUNG ELECTRONICS CO LTD0 citations47
US12135772B2Nov 5, 2024

Biometric authentication system and electronic device for same

SAMSUNG ELECTRONICS CO LTD0 citations47
US11366888B2Jun 21, 2022

Electronic device using a fingerprint sensor included in a display of the electronic device and controlling method thereof

SAMSUNG ELECTRONICS CO LTD0 citations42
US12532730B2Jan 20, 2026

Semiconductor package with semiconductor chips

SAMSUNG ELECTRONICS CO LTD0 citations40

NHN CORP

2 patents

LG ELECTRONICS INC

1 patent

KOREA ADVANCED INST SCI & TECH

1 patent