Inventor
TAY BUN KIAN
MY4 patents
Patents
4 patentsUS12575429B2Mar 10, 2026
Semiconductor package having a lead frame and a clip frame
INFINEON TECHNOLOGIES AG0 citations60
US10964628B2Mar 30, 2021
Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
INFINEON TECHNOLOGIES AG0 citations60
US10978378B2Apr 13, 2021
Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier
INFINEON TECHNOLOGIES AG0 citations53
US11515244B2Nov 29, 2022
Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
INFINEON TECHNOLOGIES AG0 citations47