Inventor
ANDERSON DIRK N
US18 patents
⚠️ This page may combine multiple inventors who share the name “ANDERSON DIRK N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
17 patentsUS5796151AAug 18, 1998
Semiconductor stack having a dielectric sidewall for prevention of oxidation of tungsten in tungsten capped poly-silicon gate electrodes
TEXAS INSTRUMENTS INC112 citations98
US5300447AApr 5, 1994
Method of manufacturing a minimum scaled transistor
TEXAS INSTRUMENTS INC158 citations98
US6245605B1Jun 12, 2001
Method to protect metal from oxidation during poly-metal gate formation in semiconductor device manufacturing
TEXAS INSTRUMENTS INC62 citations96
US6100188AAug 8, 2000
Stable and low resistance metal/barrier/silicon stack structure and related process for manufacturing
TEXAS INSTRUMENTS INC55 citations96
US6187656B1Feb 13, 2001
CVD-based process for manufacturing stable low-resistivity poly-metal gate electrodes
TEXAS INSTRUMENTS INC58 citations94
US6720247B2Apr 13, 2004
Pre-pattern surface modification for low-k dielectrics using A H2 plasma
TEXAS INSTRUMENTS INC48 citations92
US6380008B2Apr 30, 2002
Edge stress reduction by noncoincident layers
TEXAS INSTRUMENTS INC39 citations92
US6159835ADec 12, 2000
Encapsulated low resistance gate structure and method for forming same
TEXAS INSTRUMENTS INC30 citations92
US4808552AFeb 28, 1989
Process for making vertically-oriented interconnections for VLSI devices
TEXAS INSTRUMENTS INC49 citations92
US4751198AJun 14, 1988
Process for making contacts and interconnections using direct-reacted silicide
TEXAS INSTRUMENTS INC20 citations82
US6559050B1May 6, 2003
Process for high thermal stable contact formation in manufacturing sub-quarter-micron CMOS devices
TEXAS INSTRUMENTS INC7 citations73
US6373088B2Apr 16, 2002
Edge stress reduction by noncoincident layers
TEXAS INSTRUMENTS INC10 citations73
US4922320AMay 1, 1990
Integrated circuit metallization with reduced electromigration
TEXAS INSTRUMENTS INC13 citations73
US4744858AMay 17, 1988
Integrated circuit metallization with reduced electromigration
TEXAS INSTRUMENTS INC13 citations73
US4589196AMay 20, 1986
Contacts for VLSI devices using direct-reacted silicide
TEXAS INSTRUMENTS INC19 citations73
US5216265AJun 1, 1993
Integrated circuit memory devices with high angle implant around top of trench to reduce gated diode leakage
TEXAS INSTRUMENTS INC10 citations68
US6861348B2Mar 1, 2005
Pre-pattern surface modification of low-k dielectrics
TEXAS INSTRUMENTS INC1 citations51