Inventor
KIRMSE KAREN H R
US5 patents
Patents
5 patentsUS7214609B2May 8, 2007
Methods for forming single damascene via or trench cavities and for forming dual damascene via cavities
TEXAS INSTRUMENTS INC33 citations89
US7229869B2Jun 12, 2007
Method for manufacturing a semiconductor device using a sidewall spacer etchback
TEXAS INSTRUMENTS INC11 citations82
US9607847B1Mar 28, 2017
Enhanced lateral cavity etch
TEXAS INSTRUMENTS INC2 citations70
US6998221B2Feb 14, 2006
Method for forming a via in a substrate
TEXAS INSTRUMENTS INC8 citations70
US7569464B2Aug 4, 2009
Method for manufacturing a semiconductor device having improved across chip implant uniformity
TEXAS INSTRUMENTS INC2 citations60