Inventor

KANG WON JOON

KR4 patents

⚠️ This page may combine multiple inventors who share the name “KANG WON JOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AMKOR TECHNOLOGY INC

3 patents

US8026589B1Sep 27, 2011

Reduced profile stackable semiconductor package

AMKOR TECHNOLOGY INC67 citations96

US9929075B2Mar 27, 2018

Chip-scale electronic package structure with conductive connective element having increased surface area and laterally spaced connection points for improved connectivity

AMKOR TECHNOLOGY INC2 citations71

US11011455B2May 18, 2021

Electronic package structure with improved board level reliability

AMKOR TECHNOLOGY INC0 citations60

AMKOR TECH SINGAPORE HOLDING PTE LTD

1 patent

US12131982B2Oct 29, 2024

Electronic package structure with reduced vertical stress regions

AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations60