P

Inventor

WU PAUL Y

US9 patents
⚠️ This page may combine multiple inventors who share the name “WU PAUL Y”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

XILINX INC

3 patents
US9006030B1Apr 14, 2015

Warpage management for fan-out mold packaged integrated circuit

XILINX INC47 citations91
US8743559B1Jun 3, 2014

Interconnect pattern for semiconductor packaging

XILINX INC1 citations51
US10038259B2Jul 31, 2018

Low insertion loss package pin structure and method

XILINX INC0 citations38

ABUGHARBIEH KHALDOON S

1 patent
US9337138B1May 10, 2016

Capacitors within an interposer coupled to supply and ground planes of a substrate

ABUGHARBIEH KHALDOON S36 citations91

KIM NAMHOON

1 patent
US8519542B2Aug 27, 2013

Air through-silicon via structure

KIM NAMHOON9 citations81

GHIA ATUL V

1 patent
US8410579B2Apr 2, 2013

Power distribution network

GHIA ATUL V8 citations79

WYLAND CHRISTOPHER P

1 patent
US9377802B1Jun 28, 2016

Dynamic configuration of equivalent series resistance

WYLAND CHRISTOPHER P5 citations70

WU PAUL Y

1 patent
US9144150B2Sep 22, 2015

Conductor structure with integrated via element

WU PAUL Y4 citations65

CHEE SOON-SHIN

1 patent
US8178962B1May 15, 2012

Semiconductor device package and methods of manufacturing the same

CHEE SOON-SHIN2 citations54