Inventor
CHAKRAVORTY KISHORE K
US44 patents
⚠️ This page may combine multiple inventors who share the name “CHAKRAVORTY KISHORE K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
16 patentsUS6970362B1Nov 29, 2005
Electronic assemblies and systems comprising interposer with embedded capacitors
INTEL CORP147 citations99
US6611419B1Aug 26, 2003
Electronic assembly comprising substrate with embedded capacitors
INTEL CORP192 citations99
US6452776B1Sep 17, 2002
Capacitor with defect isolation and bypass
INTEL CORP151 citations99
US7339798B2Mar 4, 2008
Electronic assemblies and systems comprising interposer with embedded capacitors
INTEL CORP57 citations98
US6754407B2Jun 22, 2004
Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board
INTEL CORP104 citations98
US6477034B1Nov 5, 2002
Interposer substrate with low inductance capacitive paths
INTEL CORP130 citations97
US7049704B2May 23, 2006
Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board
INTEL CORP49 citations96
US6775150B1Aug 10, 2004
Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
INTEL CORP70 citations96
US6532143B2Mar 11, 2003
Multiple tier array capacitor
INTEL CORP101 citations96
US6963483B2Nov 8, 2005
Self-aligned coaxial via capacitors
INTEL CORP66 citations95
US6565730B2May 20, 2003
Self-aligned coaxial via capacitors
INTEL CORP64 citations95
US6512861B2Jan 28, 2003
Packaging and assembly method for optical coupling
INTEL CORP117 citations95
US7120031B2Oct 10, 2006
Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors
INTEL CORP26 citations92
US7535728B2May 19, 2009
Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors
INTEL CORP8 citations84
US7112285B2Sep 26, 2006
Conductive core substrate fabrication
INTEL CORP10 citations74
US7851109B2Dec 14, 2010
Low stress pellicle frames and reticle pellicle assemblies
INTEL CORP3 citations58
BOEING CO
10 patentsUS5098860AMar 24, 1992
Method of fabricating high-density interconnect structures having tantalum/tantalum oxide layers
BOEING CO160 citations99
US5436504AJul 25, 1995
Interconnect structures having tantalum/tantalum oxide layers
BOEING CO61 citations96
US5149615ASep 22, 1992
Method for producing a planar surface on which a conductive layer can be applied
BOEING CO65 citations96
US4974048ANov 27, 1990
Integrated circuit having reroutable conductive paths
BOEING CO60 citations96
US5112448AMay 12, 1992
Self-aligned process for fabrication of interconnect structures in semiconductor applications
BOEING CO43 citations93
US4988413AJan 29, 1991
Reducing plating anomalies in electroplated fine geometry conductive features
BOEING CO24 citations86
US5168542ADec 1, 1992
Low loss channel waveguide and method for making the same
BOEING CO14 citations72
US5081005AJan 14, 1992
Method for reducing chemical interaction between copper features and photosensitive dielectric compositions
BOEING CO11 citations71
US5609797AMar 11, 1997
Method for recording refractive index patterns in polyimide films
BOEING CO5 citations63
US5124238AJun 23, 1992
Fabrication of microelectronics using photosensitive polyimides
BOEING CO6 citations61
CANDESCENT TECH CORP
10 patentsUS6144144ANov 7, 2000
Patterned resistor suitable for electron-emitting device
CANDESCENT TECH CORP72 citations96
US6019657AFeb 1, 2000
Dual-layer metal for flat panel display
CANDESCENT TECH CORP65 citations95
US5894188AApr 13, 1999
Dual-layer metal for flat panel display
CANDESCENT TECH CORP21 citations91
US6149792ANov 21, 2000
Row electrode anodization
CANDESCENT TECH CORP5 citations74
US6710525B1Mar 23, 2004
Electrode structure and method for forming electrode structure for a flat panel display
CANDESCENT TECH CORP10 citations73
US6103095AAug 15, 2000
Non-hazardous wet etching method
CANDESCENT TECH CORP2 citations63
US5942841AAug 24, 1999
Row electrode anodization
CANDESCENT TECH CORP3 citations63
US6225732B1May 1, 2001
Dual-layer metal for flat panel display
CANDESCENT TECH CORP3 citations61
US6217403B1Apr 17, 2001
Gate electrode formation method
CANDESCENT TECH CORP2 citations59
US6039621AMar 21, 2000
Gate electrode formation method
CANDESCENT TECH CORP3 citations59
CANDESCENT INTELLECTUAL PROP
3 patentsUS6844663B1Jan 18, 2005
Structure and method for forming a multilayer electrode for a flat panel display device
CANDESCENT INTELLECTUAL PROP2 citations62
US6764366B1Jul 20, 2004
Electrode structure and method for forming electrode structure for a flat panel display
CANDESCENT INTELLECTUAL PROP3 citations62
US6433473B1Aug 13, 2002
Row electrode anodization
CANDESCENT INTELLECTUAL PROP0 citations48