Inventor

LING JAMIN

US6 patents

⚠️ This page may combine multiple inventors who share the name “LING JAMIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ST MICROELECTRONICS INC

2 patents

US6180509B1Jan 30, 2001

Method for forming planarized multilevel metallization in an integrated circuit

ST MICROELECTRONICS INC24 citations92

US6191484B1Feb 20, 2001

Method of forming planarized multilevel metallization in an integrated circuit

ST MICROELECTRONICS INC13 citations73

FLIP CHIP TECHNOLOGIES L L C

1 patent

US6445069B1Sep 3, 2002

Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method therefor

FLIP CHIP TECHNOLOGIES L L C63 citations91

ST ASSEMBLY TEST SERVICES LTD

1 patent

US7091469B2Aug 15, 2006

Packaging for optoelectronic devices

ST ASSEMBLY TEST SERVICES LTD6 citations69

KULICKE & SOFFA IND INC

1 patent

US7442641B2Oct 28, 2008

Integrated ball and via package and formation process

KULICKE & SOFFA IND INC5 citations61

SV PROBE PTE LTD

1 patent

US7637009B2Dec 29, 2009

Approach for fabricating probe elements for probe card assemblies using a reusable substrate

SV PROBE PTE LTD0 citations31