Inventor

MIKI ATSUSHI

JP63 patents

⚠️ This page may combine multiple inventors who share the name “MIKI ATSUSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MIKI ATSUSHI

SUMITOMO ELECTRIC INDUSTRIES

Substrate for packaging a semiconductor device

Substrate for packaging a semiconductor device having particular terminal and bump structure

Packaging structure of a semiconductor device

Substrate for packaging a semiconductor device

Semiconductor laser module

Method for packaging a semiconductor device

Apparatus for packaging a semiconductor device

Method of measuring junction temperature

Optical module

Optical module and optical device

Method for packaging semiconductor device

Method of mounting semiconductor elements

Method of mounting semiconductor elements

Method and apparatus for measuring temperature based on infrared light

Semiconductor laser device

JX NIPPON MINING & METALS CORP

Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board

Surface treated copper foil, copper clad laminate, and printed circuit board

Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device

Surface treated copper foil and laminate using the same

Surface treated copper foil, copper clad laminate, and printed circuit board

Surface treated copper foil, copper clad laminate, and printed circuit board

Surface treated copper foil, copper clad laminate, and printed circuit board

Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board

Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device

Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foil

Copper foil for printed circuit

Surface-treated copper foil

Printed wiring board, electronic device, catheter, and metallic material

FUJITSU LTD

Image capture apparatus

Image taking device, method for controlling light sources and computer program

Image taking device and personal identification system

Information processing device and burst error reproducing method

Printer control apparatus converting video data from an external host to video data for a printer

Storage device and control method for storage device

Photographing apparatus photographing method and computer program

Information processing apparatus and method for collecting communication cable log

Information processing apparatus and optical fiber inspection method

ARAI HIDETA

Liquid crystal polymer copper-clad laminate and copper foil used for said laminate

Copper foil for printed circuit

Rolled copper or copper-alloy foil provided with roughened surface

HITACHI LTD

High-pressure gas laser apparatus and method of laser processing

Fuel cell using liquid electrolyte

Winding for static induction apparatus

NIPPON SHEET GLASS CO LTD

Glass panel and glass window

Method for manufacturing glass panel, and glass panel

KOBAYASHI YOUSUKE

Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil

Method of roughening rolled copper or copper alloy foil

AUTONETWORKS TECHNOLOGIES LTD

Voltage converting device

Correction device for A/D converter and A/D conversion device

MORITO CO LTD

Eyelet