Inventor · disambiguated record
Chengzi Yang
Also filed as: YANG CHENGZI
1 granted patent·1 pending application·0 citations·filing 2020–2021
1Inventor score
Files withUNIV XI AN JIAOTONG2
Top patents by PatentIndex Score
2 records- 0138US11158609B2Three-dimensional integrated package device for high-voltage silicon carbide power moduleUNIV XI AN JIAOTONG·Filed 2020·Granted Oct 26, 2021·0 cites·9 claims
- 0235US2021364555A1Current detection circuit applied to sic field effect transistorUNIV XI AN JIAOTONG·Filed 2021·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →