P

Inventor

LIANG JIMMY

TW10 patents
⚠️ This page may combine multiple inventors who share the name “LIANG JIMMY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

4 patents
US7838424B2Nov 23, 2010

Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching

TAIWAN SEMICONDUCTOR MFG84 citations96
US8049323B2Nov 1, 2011

Chip holder with wafer level redistribution layer

TAIWAN SEMICONDUCTOR MFG2 citations62
US7642129B2Jan 5, 2010

Ball-mounting method for coplanarity improvement in large package

TAIWAN SEMICONDUCTOR MFG3 citations60
US9362236B2Jun 7, 2016

Package structures and methods for forming the same

TAIWAN SEMICONDUCTOR MFG0 citations52

TEXAS INSTRUMENTS INC

3 patents
US7056767B2Jun 6, 2006

Method and apparatus for flip chip device assembly by radiant heating

TEXAS INSTRUMENTS INC16 citations77
US5644168AJul 1, 1997

Mechanical interlocking of fillers and epoxy/resin

TEXAS INSTRUMENTS INC10 citations68
US6265769B1Jul 24, 2001

Double-sided chip mount package

TEXAS INSTRUMENTS INC5 citations55

CHU TSE MIN

1 patent
US8416576B2Apr 9, 2013

Integrated circuit card

CHU TSE MIN2 citations50

CHU KUEI-WU

1 patent
US8184464B2May 22, 2012

Flash memory

CHU KUEI-WU0 citations39

LU LEO

1 patent
US8424357B2Apr 23, 2013

Easily stackable dies

LU LEO0 citations25