Inventor
PAYNTER CHARLES DAVID
US14 patents
Patents
14 patentsUS10321575B2Jun 11, 2019
Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components
QUALCOMM INC8 citations82
US10008316B2Jun 26, 2018
Inductor embedded in a package substrate
QUALCOMM INC4 citations72
US11452246B2Sep 20, 2022
Patch substrate configured as a shield located over a cavity of a board
QUALCOMM INC5 citations69
US10170232B2Jan 1, 2019
Toroid inductor with reduced electromagnetic field leakage
QUALCOMM INC1 citations62
US10231324B2Mar 12, 2019
Staggered power structure in a power distribution network (PDN)
QUALCOMM INC1 citations61
US9153560B2Oct 6, 2015
Package on package (PoP) integrated device comprising a redistribution layer
QUALCOMM INC2 citations61
US12243855B2Mar 4, 2025
Package comprising channel interconnects located between solder interconnects
QUALCOMM INC0 citations60
US12512401B2Dec 30, 2025
Integrated device substrate including embedded electromagnetic isolation structure
QUALCOMM INC0 citations59
US11605594B2Mar 14, 2023
Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate
QUALCOMM INC0 citations56
US9514966B2Dec 6, 2016
Apparatus and methods for shielding differential signal pin pairs
QUALCOMM INC1 citations51
US11784157B2Oct 10, 2023
Package comprising integrated devices coupled through a metallization layer
QUALCOMM INC0 citations50
US9484281B2Nov 1, 2016
Systems and methods for thermal dissipation
QUALCOMM INC1 citations50
US12160952B2Dec 3, 2024
Providing a lower inductance path in a routing substrate for a capacitor, and related electronic devices and fabrication methods
QUALCOMM INC0 citations49
US9871012B2Jan 16, 2018
Method and apparatus for routing die signals using external interconnects
QUALCOMM INC1 citations49