Inventor
LIN WEI-HSUN
TW14 patents
⚠️ This page may combine multiple inventors who share the name “LIN WEI-HSUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS9372227B2Jun 21, 2016
Integrated circuit test system and method
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations83
US11073551B2Jul 27, 2021
Method and system for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US12313675B2May 27, 2025
Method and device for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12270852B2Apr 8, 2025
Method and system for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12066484B2Aug 20, 2024
Method and device for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12025655B2Jul 2, 2024
Method and system for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11754621B2Sep 12, 2023
Method and device for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11630149B2Apr 18, 2023
Method and system for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11448692B2Sep 20, 2022
Method and device for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11249112B2Feb 15, 2022
Devices for high-density probing techniques and method of implementing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10718790B2Jul 21, 2020
Devices for high-density probing techniques and method of implementing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10274518B2Apr 30, 2019
Devices for high-density probing techniques and method of implementing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9354254B2May 31, 2016
Test-yield improvement devices for high-density probing techniques and method of implementing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50