Inventor
LU YINLUNG
TW25 patents
Patents
25 patentsUS11073551B2Jul 27, 2021
Method and system for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10957664B2Mar 23, 2021
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10707179B1Jul 7, 2020
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11616002B2Mar 28, 2023
Through-circuit vias in interconnect structures
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10726191B2Jul 28, 2020
Method and system for manufacturing a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations69
US12382587B2Aug 5, 2025
Methods and systems for improving surface mount joinder
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12349268B2Jul 1, 2025
Package component
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12313675B2May 27, 2025
Method and device for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12270852B2Apr 8, 2025
Method and system for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12066484B2Aug 20, 2024
Method and device for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12025655B2Jul 2, 2024
Method and system for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11924965B2Mar 5, 2024
Package component and forming method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11754621B2Sep 12, 2023
Method and device for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11630149B2Apr 18, 2023
Method and system for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11448692B2Sep 20, 2022
Method and device for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12293959B2May 6, 2025
Through-circuit Vias in interconnect structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12243805B2Mar 4, 2025
Through-circuit vias in interconnect structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11830832B2Nov 28, 2023
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11309258B2Apr 19, 2022
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11361141B2Jun 14, 2022
Method and system for manufacturing a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59
US12575436B2Mar 10, 2026
Semiconductor device with protective structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12476178B2Nov 18, 2025
Reduction of cracks in redistribution structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12469807B2Nov 11, 2025
Fan-out package structures with cascaded openings in enhancement layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12388047B2Aug 12, 2025
Integrated fan-out platform and manufacturing method for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US12593711B2Mar 31, 2026
Bonding structure with stress buffer zone and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48