Inventor
APPELT BERND KARL-HEINZ
US7 patents
Patents
7 patentsUS6902869B2Jun 7, 2005
Manufacturing methods for printed circuit boards
IBM156 citations97
US6222136B1Apr 24, 2001
Printed circuit board with continuous connective bumps
IBM131 citations97
US5900675AMay 4, 1999
Organic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion rates
IBM93 citations97
US6015520AJan 18, 2000
Method for filling holes in printed wiring boards
IBM84 citations95
US5981880ANov 9, 1999
Electronic device packages having glass free non conductive layers
IBM33 citations92
US6684497B2Feb 3, 2004
Manufacturing methods for printed circuit boards
IBM16 citations91
US7240430B2Jul 10, 2007
Manufacturing methods for printed circuit boards
IBM2 citations61