Inventor
FARQUHAR DONALD SETON
US30 patents
⚠️ This page may combine multiple inventors who share the name “FARQUHAR DONALD SETON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
22 patentsUS6902869B2Jun 7, 2005
Manufacturing methods for printed circuit boards
IBM156 citations97
US6222136B1Apr 24, 2001
Printed circuit board with continuous connective bumps
IBM131 citations97
US6214525B1Apr 10, 2001
Printed circuit board with circuitized cavity and methods of producing same
IBM105 citations97
US5900675AMay 4, 1999
Organic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion rates
IBM93 citations97
US5981312ANov 9, 1999
Method for injection molded flip chip encapsulation
IBM72 citations96
US6015520AJan 18, 2000
Method for filling holes in printed wiring boards
IBM84 citations95
US5847324ADec 8, 1998
High performance electrical cable
IBM65 citations95
US6329713B1Dec 11, 2001
Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrate
IBM68 citations94
US6552263B2Apr 22, 2003
Method of injection molded flip chip encapsulation
IBM18 citations92
US6407461B1Jun 18, 2002
Injection molded integrated circuit chip assembly
IBM37 citations92
US6369449B2Apr 9, 2002
Method and apparatus for injection molded flip chip encapsulation
IBM23 citations92
US6066386AMay 23, 2000
Printed circuit board with cavity for circuitization
IBM27 citations92
US5784782AJul 28, 1998
Method for fabricating printed circuit boards with cavities
IBM44 citations92
US6684497B2Feb 3, 2004
Manufacturing methods for printed circuit boards
IBM16 citations91
US6503821B2Jan 7, 2003
Integrated circuit chip carrier assembly
IBM39 citations91
US5792375AAug 11, 1998
Method for bonding copper-containing surfaces together
IBM15 citations74
US6570261B2May 27, 2003
Method and apparatus for injection molded flip chip encapsulation
IBM11 citations73
US5993579ANov 30, 1999
High performance electrical cable and method of manufacture
IBM4 citations62
US7240430B2Jul 10, 2007
Manufacturing methods for printed circuit boards
IBM2 citations61
US7063756B2Jun 20, 2006
Enhanced design and process for a conductive adhesive
IBM2 citations57
US6534724B1Mar 18, 2003
Enhanced design and process for a conductive adhesive
IBM0 citations47
US5872337AFeb 16, 1999
Chip carrier and cable assembly reinforced at edges
IBM0 citations38
FARQUHAR DONALD SETON
4 patentsUS8674377B2Mar 18, 2014
Optoelectronic device package, array and method of fabrication
FARQUHAR DONALD SETON29 citations92
US8102119B2Jan 24, 2012
Encapsulated optoelectronic device and method for making the same
FARQUHAR DONALD SETON5 citations61
US8137148B2Mar 20, 2012
Method of manufacturing monolithic parallel interconnect structure
FARQUHAR DONALD SETON4 citations59
US8273980B2Sep 25, 2012
Photovoltaic roof ridge cap and installation method
FARQUHAR DONALD SETON5 citations57