Inventor
JAPP ROBERT MAYNARD
US30 patents
⚠️ This page may combine multiple inventors who share the name “JAPP ROBERT MAYNARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
29 patentsUS6214525B1Apr 10, 2001
Printed circuit board with circuitized cavity and methods of producing same
IBM105 citations97
US5900675AMay 4, 1999
Organic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion rates
IBM93 citations97
US6351030B2Feb 26, 2002
Electronic package utilizing protective coating
IBM70 citations94
US5888850AMar 30, 1999
Method for providing a protective coating and electronic package utilizing same
IBM61 citations94
US6534179B2Mar 18, 2003
Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use
IBM25 citations92
US6387205B1May 14, 2002
Dustfree prepreg and method for making an article based thereon
IBM16 citations92
US6066386AMay 23, 2000
Printed circuit board with cavity for circuitization
IBM27 citations92
US5928970AJul 27, 1999
Dustfree prepreg and method for making an article based thereon
IBM20 citations92
US5863332AJan 26, 1999
Fluid jet impregnating and coating device with thickness control capability
IBM26 citations92
US5784782AJul 28, 1998
Method for fabricating printed circuit boards with cavities
IBM44 citations92
US5756405AMay 26, 1998
Technique for forming resin-impregnated fiberglass sheets
IBM19 citations92
US5719090AFeb 17, 1998
Technique for forming resin-imprenated fiberglass sheets with improved resistance to pinholing
IBM17 citations92
US6176985B1Jan 23, 2001
Laminated electroplating rack and connection system for optimized plating
IBM29 citations91
US5858461AJan 12, 1999
Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing
IBM14 citations82
US5780366AJul 14, 1998
Technique for forming resin-impregnated fiberglass sheets using multiple resins
IBM14 citations82
US5800874ASep 1, 1998
Technique for forming resin-impregnated fiberglass sheets
IBM14 citations81
US6136733AOct 24, 2000
Method for reducing coefficient of thermal expansion in chip attach packages
IBM15 citations80
US5871819AFeb 16, 1999
Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing
IBM11 citations74
US6080684AJun 27, 2000
Dustfree prepreg and method for making an article based thereon
IBM6 citations73
US5773371AJun 30, 1998
Technique for forming resin-impregnated fiberglass sheets
IBM6 citations73
US6841026B2Jan 11, 2005
Method for reducing coefficient of thermal expansion in chip attach packages
IBM6 citations72
US6586352B1Jul 1, 2003
Method for reducing coefficient of thermal expansion in chip attach packages
IBM10 citations72
US6387830B1May 14, 2002
Method for reducing coefficient of thermal expansion in chip attach packages
IBM9 citations72
US6096665AAug 1, 2000
Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing
IBM2 citations63
US5866203AFeb 2, 1999
Technique for forming resin-impregnated fiberglass sheets using multiple resins
IBM1 citations63
US6071559AJun 6, 2000
Dustfree prepreg and method for making an article based thereon
IBM2 citations62
US5783252AJul 21, 1998
Technique for forming resin-impregnated fiberglass sheets
IBM2 citations62
US6838400B1Jan 4, 2005
UV absorbing glass cloth and use thereof
IBM4 citations60
US5874370AFeb 23, 1999
Technique for forming resin-impregnated fiberglass sheets using multiple resins
IBM0 citations52