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Inventor
YEOH HWAI-PENG
US
2 patents
Patents
2 patents
US6413849B1
Jul 2, 2002
Integrated circuit package with surface mounted pins on an organic substrate and method of fabrication therefor
INTEL CORP
20 citations
87
US6600233B2
Jul 29, 2003
Integrated circuit package with surface mounted pins on an organic substrate
INTEL CORP
11 citations
68