Inventor
WU JUAN-YUAN
TW62 patents
⚠️ This page may combine multiple inventors who share the name “WU JUAN-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
49 patentsUS6203863B1Mar 20, 2001
Method of gap filling
UNITED MICROELECTRONICS CORP318 citations99
US6169012B1Jan 2, 2001
Chemical mechanical polishing for forming a shallow trench isolation structure
UNITED MICROELECTRONICS CORP32 citations96
US6093089AJul 25, 2000
Apparatus for controlling uniformity of polished material
UNITED MICROELECTRONICS CORP55 citations96
US6117345ASep 12, 2000
High density plasma chemical vapor deposition process
UNITED MICROELECTRONICS CORP44 citations95
US6838357B2Jan 4, 2005
Chemical mechanical polishing for forming a shallow trench isolation structure
UNITED MICROELECTRONICS CORP13 citations93
US6344408B1Feb 5, 2002
Method for improving non-uniformity of chemical mechanical polishing by over coating
UNITED MICROELECTRONICS CORP44 citations93
US6319814B1Nov 20, 2001
Method of fabricating dual damascene
UNITED MICROELECTRONICS CORP38 citations93
US6313028B2Nov 6, 2001
Method of fabricating dual damascene structure
UNITED MICROELECTRONICS CORP22 citations93
US6239018B1May 29, 2001
Method for forming dielectric layers
UNITED MICROELECTRONICS CORP29 citations93
US6214745B1Apr 10, 2001
Method of improving surface planarity of chemical-mechanical polishing operation by forming shallow dummy pattern
UNITED MICROELECTRONICS CORP21 citations93
US6178543B1Jan 23, 2001
Method of designing active region pattern with shift dummy pattern
UNITED MICROELECTRONICS CORP25 citations93
US6156642ADec 5, 2000
Method of fabricating a dual damascene structure in an integrated circuit
UNITED MICROELECTRONICS CORP21 citations93
US6099705AAug 8, 2000
Physical vapor deposition device for forming a uniform metal layer on a semiconductor wafer
UNITED MICROELECTRONICS CORP28 citations93
US6048771AApr 11, 2000
Shallow trench isolation technique
UNITED MICROELECTRONICS CORP41 citations93
US5958795ASep 28, 1999
Chemical-mechanical polishing for shallow trench isolation
UNITED MICROELECTRONICS CORP30 citations93
US6293850B1Sep 25, 2001
Chemical-mechanical polish machines and fabrication process using the same
UNITED MICROELECTRONICS CORP28 citations92
US6183350B1Feb 6, 2001
Chemical-mechanical polish machines and fabrication process using the same
UNITED MICROELECTRONICS CORP28 citations92
US6146974ANov 14, 2000
Method of fabricating shallow trench isolation (STI)
UNITED MICROELECTRONICS CORP32 citations92
US6077147AJun 20, 2000
Chemical-mechanical polishing station with end-point monitoring device
UNITED MICROELECTRONICS CORP42 citations92
US5959311ASep 28, 1999
Structure of an antenna effect monitor
UNITED MICROELECTRONICS CORP34 citations92
US6174793B1Jan 16, 2001
Method for enhancing adhesion between copper and silicon nitride
UNITED MICROELECTRONICS CORP28 citations89
US6790742B2Sep 14, 2004
Chemical mechanical polishing in forming semiconductor device
UNITED MICROELECTRONICS CORP14 citations84
US6221744B1Apr 24, 2001
Method for forming a gate
UNITED MICROELECTRONICS CORP18 citations84
US5993647ANov 30, 1999
Circulation system of slurry
UNITED MICROELECTRONICS CORP18 citations84
US6036356AMar 14, 2000
In-situ slurry mixing apparatus
UNITED MICROELECTRONICS CORP17 citations83
US7018906B2Mar 28, 2006
Chemical mechanical polishing for forming a shallow trench isolation structure
UNITED MICROELECTRONICS CORP10 citations74
US6580508B1Jun 17, 2003
Method for monitoring a semiconductor wafer in a chemical mechanical polishing process
UNITED MICROELECTRONICS CORP9 citations74
US6562731B2May 13, 2003
Method for forming dielectric layers
UNITED MICROELECTRONICS CORP7 citations74
US6448159B1Sep 10, 2002
Chemical mechanical polishing for forming a shallow trench isolation structure
UNITED MICROELECTRONICS CORP6 citations74
US6319861B1Nov 20, 2001
Method of improving deposition
UNITED MICROELECTRONICS CORP14 citations74
US6261977B1Jul 17, 2001
Method for preventing an electrostatic chuck from being corroded during a cleaning process
UNITED MICROELECTRONICS CORP11 citations74
US6228209B1May 8, 2001
Equipment for forming a glue layer of an opening
UNITED MICROELECTRONICS CORP6 citations74
US6207497B1Mar 27, 2001
Conformity of ultra-thin nitride deposition for DRAM capacitor
UNITED MICROELECTRONICS CORP11 citations74
US6180451B1Jan 30, 2001
Method of forming capacitor with a HSG layer
UNITED MICROELECTRONICS CORP7 citations74
US6171899B1Jan 9, 2001
Method for fabricating a capacitor
UNITED MICROELECTRONICS CORP11 citations74
US6062964AMay 16, 2000
Chemical mechanical polishing apparatus for controlling slurry distribution
UNITED MICROELECTRONICS CORP8 citations74
US6024106AFeb 15, 2000
Post-CMP wafer clean process
UNITED MICROELECTRONICS CORP14 citations74
US6015755AJan 18, 2000
Method of fabricating a trench isolation structure using a reverse mask
UNITED MICROELECTRONICS CORP15 citations74
US6001694ADec 14, 1999
Manufacturing method for integrated circuit dielectric layer
UNITED MICROELECTRONICS CORP16 citations74
US7271101B2Sep 18, 2007
High density plasma chemical vapor deposition process
UNITED MICROELECTRONICS CORP6 citations73
US7078346B2Jul 18, 2006
High density plasma chemical vapor deposition process
UNITED MICROELECTRONICS CORP5 citations73
US6627387B2Sep 30, 2003
Method of photolithography
UNITED MICROELECTRONICS CORP8 citations73
US6255023B1Jul 3, 2001
Method of manufacturing binary phase shift mask
UNITED MICROELECTRONICS CORP11 citations73
US6241582B1Jun 5, 2001
Chemical mechanical polish machines and fabrication process using the same
UNITED MICROELECTRONICS CORP6 citations73
US6242352B1Jun 5, 2001
Method of preventing micro-scratches on the surface of a semiconductor wafer when performing a CMP process
UNITED MICROELECTRONICS CORP11 citations69
US7001713B2Feb 21, 2006
Method of forming partial reverse active mask
UNITED MICROELECTRONICS CORP2 citations63
US6809022B2Oct 26, 2004
Method for forming dielectric layers
UNITED MICROELECTRONICS CORP2 citations63
US6486040B2Nov 26, 2002
Chemical mechanical polishing for forming a shallow trench isolation structure
UNITED MICROELECTRONICS CORP2 citations63
US6362101B2Mar 26, 2002
Chemical mechanical polishing methods using low pH slurry mixtures
UNITED MICROELECTRONICS CORP4 citations63
LIU CHIH-CHIEN
1 patentShowing the top 50 of 62 patents by PatentIndex Score.