P

Inventor

WU JUAN-YUAN

TW62 patents
⚠️ This page may combine multiple inventors who share the name “WU JUAN-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

49 patents
US6203863B1Mar 20, 2001

Method of gap filling

UNITED MICROELECTRONICS CORP318 citations99
US6169012B1Jan 2, 2001

Chemical mechanical polishing for forming a shallow trench isolation structure

UNITED MICROELECTRONICS CORP32 citations96
US6093089AJul 25, 2000

Apparatus for controlling uniformity of polished material

UNITED MICROELECTRONICS CORP55 citations96
US6117345ASep 12, 2000

High density plasma chemical vapor deposition process

UNITED MICROELECTRONICS CORP44 citations95
US6838357B2Jan 4, 2005

Chemical mechanical polishing for forming a shallow trench isolation structure

UNITED MICROELECTRONICS CORP13 citations93
US6344408B1Feb 5, 2002

Method for improving non-uniformity of chemical mechanical polishing by over coating

UNITED MICROELECTRONICS CORP44 citations93
US6319814B1Nov 20, 2001

Method of fabricating dual damascene

UNITED MICROELECTRONICS CORP38 citations93
US6313028B2Nov 6, 2001

Method of fabricating dual damascene structure

UNITED MICROELECTRONICS CORP22 citations93
US6239018B1May 29, 2001

Method for forming dielectric layers

UNITED MICROELECTRONICS CORP29 citations93
US6214745B1Apr 10, 2001

Method of improving surface planarity of chemical-mechanical polishing operation by forming shallow dummy pattern

UNITED MICROELECTRONICS CORP21 citations93
US6178543B1Jan 23, 2001

Method of designing active region pattern with shift dummy pattern

UNITED MICROELECTRONICS CORP25 citations93
US6156642ADec 5, 2000

Method of fabricating a dual damascene structure in an integrated circuit

UNITED MICROELECTRONICS CORP21 citations93
US6099705AAug 8, 2000

Physical vapor deposition device for forming a uniform metal layer on a semiconductor wafer

UNITED MICROELECTRONICS CORP28 citations93
US6048771AApr 11, 2000

Shallow trench isolation technique

UNITED MICROELECTRONICS CORP41 citations93
US5958795ASep 28, 1999

Chemical-mechanical polishing for shallow trench isolation

UNITED MICROELECTRONICS CORP30 citations93
US6293850B1Sep 25, 2001

Chemical-mechanical polish machines and fabrication process using the same

UNITED MICROELECTRONICS CORP28 citations92
US6183350B1Feb 6, 2001

Chemical-mechanical polish machines and fabrication process using the same

UNITED MICROELECTRONICS CORP28 citations92
US6146974ANov 14, 2000

Method of fabricating shallow trench isolation (STI)

UNITED MICROELECTRONICS CORP32 citations92
US6077147AJun 20, 2000

Chemical-mechanical polishing station with end-point monitoring device

UNITED MICROELECTRONICS CORP42 citations92
US5959311ASep 28, 1999

Structure of an antenna effect monitor

UNITED MICROELECTRONICS CORP34 citations92
US6174793B1Jan 16, 2001

Method for enhancing adhesion between copper and silicon nitride

UNITED MICROELECTRONICS CORP28 citations89
US6790742B2Sep 14, 2004

Chemical mechanical polishing in forming semiconductor device

UNITED MICROELECTRONICS CORP14 citations84
US6221744B1Apr 24, 2001

Method for forming a gate

UNITED MICROELECTRONICS CORP18 citations84
US5993647ANov 30, 1999

Circulation system of slurry

UNITED MICROELECTRONICS CORP18 citations84
US6036356AMar 14, 2000

In-situ slurry mixing apparatus

UNITED MICROELECTRONICS CORP17 citations83
US7018906B2Mar 28, 2006

Chemical mechanical polishing for forming a shallow trench isolation structure

UNITED MICROELECTRONICS CORP10 citations74
US6580508B1Jun 17, 2003

Method for monitoring a semiconductor wafer in a chemical mechanical polishing process

UNITED MICROELECTRONICS CORP9 citations74
US6562731B2May 13, 2003

Method for forming dielectric layers

UNITED MICROELECTRONICS CORP7 citations74
US6448159B1Sep 10, 2002

Chemical mechanical polishing for forming a shallow trench isolation structure

UNITED MICROELECTRONICS CORP6 citations74
US6319861B1Nov 20, 2001

Method of improving deposition

UNITED MICROELECTRONICS CORP14 citations74
US6261977B1Jul 17, 2001

Method for preventing an electrostatic chuck from being corroded during a cleaning process

UNITED MICROELECTRONICS CORP11 citations74
US6228209B1May 8, 2001

Equipment for forming a glue layer of an opening

UNITED MICROELECTRONICS CORP6 citations74
US6207497B1Mar 27, 2001

Conformity of ultra-thin nitride deposition for DRAM capacitor

UNITED MICROELECTRONICS CORP11 citations74
US6180451B1Jan 30, 2001

Method of forming capacitor with a HSG layer

UNITED MICROELECTRONICS CORP7 citations74
US6171899B1Jan 9, 2001

Method for fabricating a capacitor

UNITED MICROELECTRONICS CORP11 citations74
US6062964AMay 16, 2000

Chemical mechanical polishing apparatus for controlling slurry distribution

UNITED MICROELECTRONICS CORP8 citations74
US6024106AFeb 15, 2000

Post-CMP wafer clean process

UNITED MICROELECTRONICS CORP14 citations74
US6015755AJan 18, 2000

Method of fabricating a trench isolation structure using a reverse mask

UNITED MICROELECTRONICS CORP15 citations74
US6001694ADec 14, 1999

Manufacturing method for integrated circuit dielectric layer

UNITED MICROELECTRONICS CORP16 citations74
US7271101B2Sep 18, 2007

High density plasma chemical vapor deposition process

UNITED MICROELECTRONICS CORP6 citations73
US7078346B2Jul 18, 2006

High density plasma chemical vapor deposition process

UNITED MICROELECTRONICS CORP5 citations73
US6627387B2Sep 30, 2003

Method of photolithography

UNITED MICROELECTRONICS CORP8 citations73
US6255023B1Jul 3, 2001

Method of manufacturing binary phase shift mask

UNITED MICROELECTRONICS CORP11 citations73
US6241582B1Jun 5, 2001

Chemical mechanical polish machines and fabrication process using the same

UNITED MICROELECTRONICS CORP6 citations73
US6242352B1Jun 5, 2001

Method of preventing micro-scratches on the surface of a semiconductor wafer when performing a CMP process

UNITED MICROELECTRONICS CORP11 citations69
US7001713B2Feb 21, 2006

Method of forming partial reverse active mask

UNITED MICROELECTRONICS CORP2 citations63
US6809022B2Oct 26, 2004

Method for forming dielectric layers

UNITED MICROELECTRONICS CORP2 citations63
US6486040B2Nov 26, 2002

Chemical mechanical polishing for forming a shallow trench isolation structure

UNITED MICROELECTRONICS CORP2 citations63
US6362101B2Mar 26, 2002

Chemical mechanical polishing methods using low pH slurry mixtures

UNITED MICROELECTRONICS CORP4 citations63

LIU CHIH-CHIEN

1 patent

Showing the top 50 of 62 patents by PatentIndex Score.