Inventor

CHIU SHIH-KUANG

TW48 patents

⚠️ This page may combine multiple inventors who share the name “CHIU SHIH-KUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIU SHIH-KUANG

SILICONWARE PRECISION INDUSTRIES CO LTD

Substrate structure of flip chip package

Flip-chip semiconductor package structure and process for fabricating the same

Flip chip semiconductor package

Semiconductor package with heat sink

Semiconductor package structure with heat-dissipation stiffener and method of fabricating the same

Method of underfilling a flip-chip semiconductor device

Flip-chip packaging process utilizing no-flow underfill technique

Method of performing flip-chip underfill in a wire-bonded chip-on-chip ball-grid array integrated circuit package module

Flip-chip bonding structure on substrate for flip-chip package application

Flip-chip bonding structure with stress-buffering property and method for making the same

Semiconductor package having conductive pillars

Semiconductor device package with a heat sink and method for fabricating the same

Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer

Bump structure with dopants

Flip-chip semiconductor package structure and process for fabricating the same

Semiconductor package and method of fabricating the same

Semiconductor device having conductive vias

Semiconductor package and method of fabricating the same

Semiconductor package and fabrication method thereof

Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layer

Method of fabricating semiconductor package having semiconductor element

Semiconductor device having conductive vias

Package structure and fabrication method thereof

Electrical testing method of interposer

Semiconductor package and method of fabricating the same

Method for fabricating package structure

Package structure and fabrication method thereof

Fabrication method of wafer level package having a pressure sensor

Fabrication method of semiconductor package

Semiconductor package and method of fabricating the same

Method for manufacturing package structure with micro-electromechanical element

Carrier, semiconductor package and fabrication method thereof

BROGENT TECH INC

Buckle device

Buckle device

Buckle device capable of displaying locked state

Illuminated buckle

Illuminated buckle

CHAN CHANG-YUEH

Package structure having MEMS element and fabrication method thereof

Package having MEMS element and fabrication method thereof

CHANG CHIANG-CHENG

Carrier, semiconductor package and fabrication method thereof

Chip scale package and fabrication method thereof

LIN CHEN-HAN

Package structure having MEMS elements and fabrication method thereof

Method for fabricating package structure having MEMS elements

HUANG CHUN-AN

Package structure with micro-electromechanical element and manufacturing method thereof

Package structure having MEMS element and fabrication method thereof

CHANG HONG-DA

Wafer level package having a pressure sensor and fabrication method thereof

Chen lu yi

Interposer and electrical testing method thereof

CHEN YAN-HENG

Semiconductor package, package structure and fabrication method thereof