P

Inventor

CHERN HORNG-NAN

TW17 patents
⚠️ This page may combine multiple inventors who share the name “CHERN HORNG-NAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

15 patents
US6211021B1Apr 3, 2001

Method for forming a borderless contact

UNITED MICROELECTRONICS CORP26 citations92
US6100158AAug 8, 2000

Method of manufacturing an alignment mark with an etched back dielectric layer and a transparent dielectric layer and a device region on a higher plane with a wiring layer and an isolation region

UNITED MICROELECTRONICS CORP27 citations92
US6040241AMar 21, 2000

Method of avoiding sidewall residue in forming connections

UNITED MICROELECTRONICS CORP20 citations92
US6238974B1May 29, 2001

Method of forming DRAM capacitors with a native oxide etch-stop

UNITED MICROELECTRONICS CORP16 citations84
US6255229B1Jul 3, 2001

Method for forming semiconductor dielectric layer

UNITED MICROELECTRONICS CORP10 citations74
US6211086B1Apr 3, 2001

Method of avoiding CMP caused residue on wafer edge uncompleted field

UNITED MICROELECTRONICS CORP7 citations74
US6124161ASep 26, 2000

Method for fabricating a hemispherical silicon grain layer

UNITED MICROELECTRONICS CORP12 citations74
US6429135B1Aug 6, 2002

Method of reducing stress between a nitride silicon spacer and a substrate

UNITED MICROELECTRONICS CORP10 citations73
US9490360B2Nov 8, 2016

Semiconductor device and operating method thereof

UNITED MICROELECTRONICS CORP5 citations71
US6177310B1Jan 23, 2001

Method for forming capacitor of memory cell

UNITED MICROELECTRONICS CORP11 citations70
US6159806ADec 12, 2000

Method for increasing the effective spacer width

UNITED MICROELECTRONICS CORP7 citations68
US6403411B1Jun 11, 2002

Method for manufacturing lower electrode of DRAM capacitor

UNITED MICROELECTRONICS CORP3 citations63
US6063660AMay 16, 2000

Fabricating method of stacked type capacitor

UNITED MICROELECTRONICS CORP5 citations63
US6140202AOct 31, 2000

Method of fabricating double-cylinder capacitor

UNITED MICROELECTRONICS CORP1 citations52
US6303435B1Oct 16, 2001

Method of fabricating a wide-based box-structured capacitor containing hemi-spherical grains

UNITED MICROELECTRONICS CORP1 citations51

POWERCHIP SEMICONDUCTOR CORP

2 patents