Inventor

RUBEN DAVID A

US69 patents

⚠️ This page may combine multiple inventors who share the name “RUBEN DAVID A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RUBEN DAVID A

MEDTRONIC INC

Techniques for bonding substrates using an intermediate layer

Pressure sensor configurations for implantable medical electrical leads

High output sensor and accelerometer implantable medical device

High output sensor and accelerometer for implantable medical device

Accelerometer for implantable medical device

Shock resistant accelerometer for implantable medical device

Apparatus and method for laser welding of ribbons

Apparatus and method for laser welding of ribbons

Implantable medical device including a first enclosure portion having a feedthrough in a second interior surface

Implantable medical device including a surface-mount terminal array

Kinetically limited nano-scale diffusion bond structures and methods

Hermeticity testing

Hermetic conductive feedthroughs for a semiconductor wafer

Sealed package and method of forming same

Sealed package and method of forming same

Pressure sensor configurations for implantable medical electrical leads

Sealed package including electronic device and power source

Feedthrough assemblies

Power source and method of forming same

Power source and method of forming same

Laser bonding tool with improved bonding accuracy

Assembly including a circuit and an encapsulation frame, and method of making the same

Sealed package and method of forming same

Hermetically-sealed packages including feedthrough assemblies

Implantable medical device system including feedthrough assembly and method of forming same

Embedded metallic structures in glass

Devices formed with techniques for bonding substrates using an intermediate layer

Hermetic assembly and device including same

Nuclear radiation particle power converter

Kinetically limited nano-scale diffusion bond structures and methods

Methods for forming hermetically-sealed packages including feedthrough assemblies

Sealed package and method of forming same

Sealed package and method of forming same

Hermetic conductive feedthroughs for a semiconductor wafer

Wafer-scale package including power source

Hermetic assembly and device including same

Nuclear radiation particle power converter

Sealed implantable medical device and method of forming same

RUBEN DAVID A

Hermetic wafer-to-wafer bonding with electrical interconnection

Techniques for bonding substrates using an intermediate layer

Metallization with tailorable coefficient of thermal expansion

Layered structure for corrosion resistant interconnect contacts

Container

O'BRIEN RICHARD J

Wafer-scale package including power source

(unassigned)

Packaging

DANZL RALPH B

Laser assisted direct bonding

MATTES MICHAEL F

Implantable capacitive pressure sensor apparatus and methods regarding same

ASKARINYA MOHSEN

Power sources suitable for use in implantable medical devices and corresponding fabrication methods

SCHULHAUSER RANDAL C

Error correction techniques in surgical navigation

DARCO INT CORPORATION

Syringe barrel