Inventor · disambiguated record
Takeshi Kagatsume
Also filed as: KAGATSUME TAKESHI
4 granted patents·2 pending applications·168 citations·filing 2000–2006
75Inventor score
Files withHOYA CORP6
Top patents by PatentIndex Score
6 records- 0195US6339197B1Multilayer printed circuit board and the manufacturing methodHOYA CORP·Filed 2000·Granted Jan 15, 2002·153 cites·16 claims
- 0288US7470865B2Multilayer printed wiring board and a process of producing sameHOYA CORP·Filed 2006·Granted Dec 30, 2008·15 cites·10 claims
- 0347US2006000640A1Multilayer printed wiring board and a process of producing sameHOYA CORP·Filed 2005·Application pending·0 cites
- 0443US8002959B2Manufacturing method of double-sided wiring glass substrateHOYA CORP·Filed 2006·Granted Aug 23, 2011·0 cites·5 claims
- 0543US7993509B2Manufacturing method of double-sided wiring glass substrateHOYA CORP·Filed 2006·Granted Aug 9, 2011·0 cites·6 claims
- 0638US2002100608A1Multilayer printed wiring board and a process of producing sameHOYA CORP·Filed 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →