Inventor
LEE SERI
US16 patents
⚠️ This page may combine multiple inventors who share the name “LEE SERI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
12 patentsUS7321184B2Jan 22, 2008
Rake shaped fan
INTEL CORP58 citations98
US6633484B1Oct 14, 2003
Heat-dissipating devices, systems, and methods with small footprint
INTEL CORP65 citations95
US6535385B2Mar 18, 2003
High performance heat sink configurations for use in high density packaging applications
INTEL CORP56 citations95
US7495922B2Feb 24, 2009
Spring loaded heat sink retention mechanism
INTEL CORP22 citations89
US6870736B2Mar 22, 2005
Heat sink and package surface design
INTEL CORP38 citations89
US6757170B2Jun 29, 2004
Heat sink and package surface design
INTEL CORP40 citations89
US6479895B1Nov 12, 2002
High performance air cooled heat sinks used in high density packaging applications
INTEL CORP27 citations88
US6845010B2Jan 18, 2005
High performance heat sink configurations for use in high density packaging applications
INTEL CORP17 citations83
US7019977B2Mar 28, 2006
Method of attaching non-adhesive thermal interface materials
INTEL CORP17 citations78
US7499274B2Mar 3, 2009
Method, apparatus and system for enclosure enhancement
INTEL CORP2 citations62
US6501655B1Dec 31, 2002
High performance fin configuration for air cooled heat sinks
INTEL CORP6 citations62
US7535708B2May 19, 2009
Fan integrated thermal management device
INTEL CORP1 citations51