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Inventor
OOROKU NORIYUKI
JP
2 patents
⚠️ This page may combine multiple inventors who share the name “OOROKU NORIYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
1 patent
US6413850B1
Jul 2, 2002
Method of forming bumps
HITACHI LTD
102 citations
96
RENESAS TECH CORP
1 patent
US7265035B2
Sep 4, 2007
Semiconductor device and its manufacturing method
RENESAS TECH CORP
18 citations
82