Inventor

MCNEIL ANDREW C

US53 patents

⚠️ This page may combine multiple inventors who share the name “MCNEIL ANDREW C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MCNEIL ANDREW C

FREESCALE SEMICONDUCTOR INC

Single proof mass, 3 axis MEMS transducer

Z-axis accelerometer with at least two gap sizes and travel stops disposed outside an active capacitor area

Single proof mass, 3 axis MEMS transducer

Transducer with decoupled sensing in mutually orthogonal directions

Differential capacitive sensor and method of making same

MEMS suspension and anchoring design

Symmetrical differential capacitive sensor and method of making same

Sensor having free fall self-test capability and method therefor

Sensor using an actuator for self-test and method therefor

MEMS device with common mode rejection structure

MEMS device and method of reducing stiction in a MEMS device

Actively preventing charge induced leakage of semiconductor devices

MEMS device with over-travel stop structure and method of fabrication

Multiple axis rate sensor

Stiction resistant mems device and method of operation

Pressure sensor with differential capacitive output

Electrically conductive barriers for integrated circuits

MEMS device having variable gap width and method of manufacture

System and method for calibrating an inertial sensor

Capacitor assembly with shielded connections and method for forming the same

MOTOROLA INC

Method for making a sculptured diaphragm

Temperature coefficient of offset adjusted semiconductor device and method thereof

Method of manufacturing a sensor

Electronic component for measuring acceleration

Method for testing pressure sensors

Method of forming an integrated CMOS capacitive pressure sensor

Electronic component and method of manufacturing

Apparatus and method of elastically bowing a base plate

Circuit and method of compensating for membrane stress in a sensor

Method of adding mass to MEMS structures

MCNEIL ANDREW C

Laterally integrated MEMS sensor device with multi-stimulus sensing

Semiconductor device with reduced sensitivity to package stress

MEMS sensor with dual proof masses

Resonant accelerometer with low sensitivity to package stress

MEMS sensor with folded torsion springs

MEMS sensor with stress isolation and method of fabrication

Pressure sensor with differential capacitive output

MEMS device having variable gap width and method of manufacture

NXP USA INC

Flexure with enhanced torsional stiffness and MEMS device incorporating same

Inertial sensor with suspension spring structure surrounding anchor

Inertial sensor with single proof mass and multiple sense axis capability

Z-axis inertial sensor with extended motion stops

LIN YIZHEN

Capacitive sensor with stress relief that compensates for package stress

MEMS device with central anchor for stress isolation

DAWSON CHAD S

Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereof

Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereof

GEISBERGER AARON A

Accelerometer with over-travel stop structure

BILIC DUBRAVKA

Combined environmental parameter sensor

LI GARY G

Inertial sensor with off-axis spring system

SCHLARMANN MARK E

MEMS device assembly and method of packaging same