Inventor
CHAE HEE SUN
KR14 patents
⚠️ This page may combine multiple inventors who share the name “CHAE HEE SUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
12 patentsUS6604012B1Aug 5, 2003
Lots dispatching method for variably arranging processing equipment and/or processing conditions in a succeeding process according to the results of a preceding process and apparatus for the same
SAMSUNG ELECTRONICS CO LTD75 citations92
US5672230ASep 30, 1997
Central management system of wet chemical stations
SAMSUNG ELECTRONICS CO LTD26 citations92
US6766210B2Jul 20, 2004
Process error prevention method in semiconductor fabricating equipment
SAMSUNG ELECTRONICS CO LTD21 citations86
US6027604AFeb 22, 2000
Dry etching apparatus having upper and lower electrodes with grooved insulating rings or grooved chamber sidewalls
SAMSUNG ELECTRONICS CO LTD25 citations86
US6370793B1Apr 16, 2002
Apparatus for controlling the temperature of a wafer located at a pre-alignment stage
SAMSUNG ELECTRONICS CO LTD18 citations84
US7101752B2Sep 5, 2006
Semiconductor process for removing defects due to edge chips of a semiconductor wafer and semiconductor device fabricated thereby
SAMSUNG ELECTRONICS CO LTD14 citations82
US6445443B1Sep 3, 2002
Lithography system including mechanism for setting optimal process parameters and method of operating the same
SAMSUNG ELECTRONICS CO LTD10 citations73
US7398801B2Jul 15, 2008
Apparatus and method for processing wafers
SAMSUNG ELECTRONICS CO LTD6 citations62
US5828039AOct 27, 1998
Method and apparatus for heating chemical used in microelectronic device fabrication
SAMSUNG ELECTRONICS CO LTD3 citations62
US5816970AOct 6, 1998
Semiconductor fabricating apparatus with remote belt tension sensor
SAMSUNG ELECTRONICS CO LTD5 citations62
US5760693AJun 2, 1998
Vacuum apparatus for semiconductor device
SAMSUNG ELECTRONICS CO LTD5 citations62
US7598180B2Oct 6, 2009
Semiconductor process for removing defects due to edge chips of a semiconductor wafer and semiconductor device fabricated thereby
SAMSUNG ELECTRONICS CO LTD4 citations61
PSK INC
2 patentsUS10312060B2Jun 4, 2019
Plasma generating apparatus using mutual inductive coupling and substrate treating apparatus comprising the same
PSK INC0 citations39
US9536708B2Jan 3, 2017
Plasma generating device, method of controlling the same, and substrate processing device including the plasma generating device
PSK INC0 citations39