P

Inventor

CHAE HEE SUN

KR14 patents
⚠️ This page may combine multiple inventors who share the name “CHAE HEE SUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

12 patents
US6604012B1Aug 5, 2003

Lots dispatching method for variably arranging processing equipment and/or processing conditions in a succeeding process according to the results of a preceding process and apparatus for the same

SAMSUNG ELECTRONICS CO LTD75 citations92
US5672230ASep 30, 1997

Central management system of wet chemical stations

SAMSUNG ELECTRONICS CO LTD26 citations92
US6766210B2Jul 20, 2004

Process error prevention method in semiconductor fabricating equipment

SAMSUNG ELECTRONICS CO LTD21 citations86
US6027604AFeb 22, 2000

Dry etching apparatus having upper and lower electrodes with grooved insulating rings or grooved chamber sidewalls

SAMSUNG ELECTRONICS CO LTD25 citations86
US6370793B1Apr 16, 2002

Apparatus for controlling the temperature of a wafer located at a pre-alignment stage

SAMSUNG ELECTRONICS CO LTD18 citations84
US7101752B2Sep 5, 2006

Semiconductor process for removing defects due to edge chips of a semiconductor wafer and semiconductor device fabricated thereby

SAMSUNG ELECTRONICS CO LTD14 citations82
US6445443B1Sep 3, 2002

Lithography system including mechanism for setting optimal process parameters and method of operating the same

SAMSUNG ELECTRONICS CO LTD10 citations73
US7398801B2Jul 15, 2008

Apparatus and method for processing wafers

SAMSUNG ELECTRONICS CO LTD6 citations62
US5828039AOct 27, 1998

Method and apparatus for heating chemical used in microelectronic device fabrication

SAMSUNG ELECTRONICS CO LTD3 citations62
US5816970AOct 6, 1998

Semiconductor fabricating apparatus with remote belt tension sensor

SAMSUNG ELECTRONICS CO LTD5 citations62
US5760693AJun 2, 1998

Vacuum apparatus for semiconductor device

SAMSUNG ELECTRONICS CO LTD5 citations62
US7598180B2Oct 6, 2009

Semiconductor process for removing defects due to edge chips of a semiconductor wafer and semiconductor device fabricated thereby

SAMSUNG ELECTRONICS CO LTD4 citations61

PSK INC

2 patents